Heat sink load balancing apparatus

ABSTRACT

A heat sink apparatus that utilizes a pivot couple and support with anchor-spring mounts to enable exertion of a uniform amount of force over the mounting surface of the apparatus that is thermally/physically coupled to a heat load. The apparatus can include a heat sink base that has a bottom side defining the mounting surface, and a top side to which a support is pivotally coupled by a pivot couple. The apparatus can include a first and second anchor that each have a first end connected to an anchor point and a second end coupled to a load surface on the support by a spring. The load surfaces can be symmetrically disposed on opposite sides of the pivot couple, which is centrally located relative to the mounting surface so that the force imparted by spring loads of the springs is evenly distributed over the mounting surface.

BACKGROUND

A heat dissipating apparatus is generally mounted on a heat load, suchthat a portion of the surface of the heat dissipating apparatus ismounted on, and thus in thermal and mechanical contact with, the heatload. The portion of the surface of the heat dissipating apparatus thatis mounted on the heat load is referred to in this specification as themounting surface.

To achieve good thermal and/or mechanical contact between the heatdissipating apparatus and the heat load, some implementations utilizeanchor-spring mounts. Each anchor of an anchor-spring mount has twoends: a first end that connects to an anchor point, which is typicallythe surface where the anchor connects to, e.g., a printed circuit board,and a second end that is coupled to the heat dissipating apparatus. Theforces exerted by the springs on the heat dissipating apparatus allowsthe mounting surface of the heat dissipating apparatus to maintain adesired contact pressure over the heat load.

SUMMARY

This specification relates to an apparatus that enables a heatdissipating apparatus (e.g., a heat sink, a cold plate, etc.), which canbe mounted on a heat load (e.g., a hot component of an electronicassembly), to exert even (or uniform) force over the heat load.

In general, one innovative aspect of the subject matter described inthis specification can be embodied in systems that include a heat sinkbase that can be thermally coupled to a heat load, the heat sink basedefining a top side and a bottom side, wherein the bottom side defines amounting surface that can be physically coupled to the heat load; asupport that is pivotally coupled by a pivot couple to the top surfaceof the heat sink base; at least a first anchor and a second anchor,wherein: the first anchor has a first end and a second end, wherein thefirst end connects to a first anchor point, and the second end iscoupled to a first load surface of the support by a first spring; thesecond anchor has a first end and a second end, wherein the first endconnects to a second anchor point, and the second end is coupled to asecond load surface of the support by a second spring; and the firstload surface and the second load surface are symmetrically disposed onopposite sides of the pivot couple; wherein the pivot couple iscentrally located relative to the mounting surface of the heat sink baseso that a force imparted by spring loads of the first and second springsis normally transferred to the mounting surface for even distributionover the mounting surface.

These and other embodiments can each optionally include one or more ofthe following features.

In some implementations, the pivot couple can include a joint coupled tothe top surface of the heat sink, wherein the joint can be centrallylocated relative to the mounting surface; and the support can be coupledto the joint, wherein the support is configured to pivot about thejoint.

In some implementations, the support can be integrated with the joint,the first spring, and the second spring.

In some implementations, the system can include a load plate coupled tothe top surface of the heat sink base; wherein the pivot couple can be arod that is coupled to the load plate at a position that is centralrelative to the mounting surface, wherein: the rod is perpendicular tothe load plate; the rod includes an opening that receives a joint intowhich the support is inserted, wherein the support is configured topivot along an axis that is perpendicular to the rod and that isparallel to the mounting surface.

In some implementations, a load plate coupled to the top surface of theheat sink base can include a pressure sensor coupled to the top surfaceof the heat sink base; the load plate coupled to the pressure sensor,wherein the pressure sensor measures force exerted by the load plate onthe top surface of the heat sink base.

In some implementations, the support can be integrated with the firstspring and the second spring.

In some implementations, a rod that is coupled to the load plate at aposition that is central to the mounting surface can include: a swivelcoupled to the load plate at a position that is central to the mountingsurface; and the rod coupled to the swivel, wherein the rod can rotateindependently of the load plate about the swivel.

In some implementations, each of the first anchor and the second anchorcan pass through a respective opening in the support and the heat sink.

Particular embodiments of the subject matter described in thisspecification can be implemented to realize one or more of the followingadvantages. For example, the innovations described in this specificationenable a heat dissipating apparatus that utilizes anchor-spring mountsto exert an even (or uniform) force distribution over the mountingsurface in comparison to conventional heat dissipating apparatuses thatutilize an anchor-spring mounting approach. Spring properties (e.g., thespring constant) can vary across multiple iterations of the same springbecause of variations in, e.g., material composition, manufacturing,batch, and tolerances. Such variation can lead to differences in springloads between identical anchor-spring mounts in conventional heatdissipating apparatuses that utilize such anchor-spring mounts. Springloads can also vary due to differences in the anchors' heights caused bydifferences in the anchors' relative displacement into, e.g., a printedcircuit board, into which each anchor is secured. Such variation inspring loads in turn leads to an uneven (or non-uniform) forcedistribution over the entire mounting surface in conventional heatdissipating apparatuses. In contrast, and as further described in thisspecification, the innovations described in this specification enableeven (or uniform) force distribution over the entire mounting surface byusing a support and pivot couple (as further described in thisspecification) in conjunction with the anchor-spring mounts, thattogether compensate for the uneven force distribution caused by, e.g.,the varying spring loads and/or the different relative displacement ofthe anchors.

The details of one or more embodiments of the subject matter describedin this specification are set forth in the accompanying drawings and thedescription below. Other features, aspects, and advantages of thesubject matter will become apparent from the description, the drawings,and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of an apparatus that uses a pivot couple and asupport in conjunction with anchor spring mounts to mount a heat sink toa heat load.

FIG. 2 is a block diagram of a first implementation of the pivot coupleand support that are utilized in mounting the heat sink base onto a heatload as shown in FIG. 1.

FIG. 3 is a block diagram of a second implementation of the pivot coupleand support that are utilized in mounting the heat sink base onto a heatload as shown in FIG. 1.

FIG. 4 is a block diagram of a third implementation of the pivot coupleand support that are utilized in mounting the heat sink base onto a heatload as shown in FIG. 1.

FIG. 5 is a block diagram of a fourth implementation of the pivot coupleand support that are utilized in mounting the heat sink base onto a heatload as shown in FIG. 1.

FIG. 6 is a block diagram of a fifth implementation of the pivot coupleand support that are utilized in mounting the heat sink base onto a heatload as shown in FIG. 1.

Like reference numbers and designations in the various drawings indicatelike elements.

DETAILED DESCRIPTION

The following description describes the structure and operation of aheat sink apparatus that utilizes a pivot couple and support inconjunction with anchor-spring mounts to enable the heat sink apparatusto exert an even (or uniform) amount of force over the entire portion ofthe heat sink apparatus that is thermally and/or mechanically in contactwith a heat load. Although the below descriptions are with reference toa heat sink apparatus, other types of heat dissipating apparatuses canbe used instead of the heat sink.

FIG. 1 is a side view 100 of an apparatus that uses a pivot couple and asupport in conjunction with anchor spring mounts to mount a heat sink toa heat load.

The apparatus shown in FIG. 1 includes a heat sink that has multipleheat fins 102, which are connected (e.g., soldered) to heat pipes 102.Each heat pipe 102 is attached to the heat sink base 112. The heat sinkbase 112 is thermally and mechanically coupled to a heat load 114. Theapparatus uses anchor-spring mounts to mount the heat sink base onto theheat load. The apparatus shown in FIG. 1 includes four anchor-springmounts (only three of which are visible in FIG. 1), i.e., four anchors106 and four springs 108. Each spring 108 that is connected to one endof a respective anchor 106, is coupled to a support 110. Although theheat sink of FIG. 1 includes four anchor-spring mounts, additional orfewer anchor-spring mounts can be used.

Details about the structure and operation of the differentimplementations of the pivot couple and support that are deployed inconjunction with the anchor-spring mounts is described below withreference to FIGS. 2-6.

FIG. 2 is a block diagram 200 of a first implementation of the pivotcouple and support that are utilized in mounting the heat sink base ontoa heat load as shown in FIG. 1.

As shown in the block diagram 200, the heat sink base 112 is mounted on,and thus is mechanically and thermally coupled to, a heat load 114. Theheat sink base 112 has a top side (also referred to as surface) and abottom side. The bottom side defines a mounting surface 214 that isphysically coupled to (i.e., in contact with) the heat load 114.

A support 110 is pivotally coupled by a pivot couple to the top surfaceof the heat sink base 112. The pivot couple in the block diagram 200 isa joint 206, which is affixed to the top surface of the heat sink base112 at a location that is central relative to the mounting surface 214of the heat sink base 112.

The heat sink base 112 is mounted onto the heat load 114 usinganchor-spring mounts. The block diagram 200 shows two anchor-springmounts: (1) a first anchor 202 and a first spring 206-A and (2) a secondanchor 204 and a second spring 206-B. Each of the first anchor 202 andthe second anchor 204 has a first end 208-B and a second end 208-A. Thefirst end 208-B of each of the anchors (202 and 204) is affixed to aprinted circuit board (PCB) 214 at a first anchor point 210-A and asecond anchor point 210-B, respectively. As shown in FIG. 1, each of theanchors 202 and 204 pass through a respective opening in the heat sinkbase 112. However, in some implementations, these anchors 202 and 204may be designed with a dent or a curve that enables these anchors to bemounted to the printed circuit board 214 without having to pass throughthe heat sink base 112.

A first spring 206-A is affixed to the second end 208-A of the firstanchor 202, and a second spring 206-B is affixed to the second end 208-Aof the second anchor 204.

The first spring 206-A rests on the support 110 at a first load surface212-A and the second spring 206-B rests on the support 110 at a secondload surface 212-B. In this manner, the second end 208-A of the firstanchor 202 is coupled to the first load surface 212-A of the support110, and the second end 208-B of the second anchor 204 is coupled to thesecond load surface 212-A of the support 110. As shown in block diagram200, the first load surface 212-A and the second load surface 212-B aresymmetrically disposed on opposite sides of the joint 206.

Spring loads of the first spring 206-A and the second spring 206-Bimpart forces onto the load surfaces of the support 110. Any unevennessin the spring forces causes the support 110 to pivot about the joint206, but nevertheless results in the spring forces being normallytransferred by the joint 206 for even distribution over the mountingsurface 214. Thus, even if the resulting spring loads of the firstspring 206-A and the second spring 206-B on the support 110 vary, aneven (or uniform) amount of force is distributed over the mountingsurface.

FIG. 3 is a block diagram 300 of a second implementation of the pivotcouple and support that are utilized in mounting the heat sink base ontoa heat load as shown in FIG. 1.

The block diagram 300 has the same operation as the apparatus shown inFIG. 2. Even the structural aspects of the apparatus shown in blockdiagram 300 are the same as those shown in FIG. 2, with one exception.Unlike FIG. 2 in which the springs 206-A and 206-B, the joint 206, andthe support 110 are discrete (and separate) components, these pieces areintegrated into one component in FIG. 3 as a support with integratedjoint and springs 312. In some implementations, the support can beintegrated with the springs 206-A and 206-B, but may not be integratedwith the joint 206. In such implementations, the joint 206 is a separatefrom the support that is integrated with the springs. Integrating thesupport with the joint and/or the springs can help reduce the cost ofthe apparatus because the resulting, integrated support could beproduced using a single manufacturing process (as opposed to a separatemanufacturing process for each of the multiple components, which islikely to be more expensive than the cost of producing a singlecomponent).

FIG. 4 is a block diagram 400 of a third implementation of the pivotcouple and support that are utilized in mounting the heat sink base ontoa heat load as shown in FIG. 1.

The block diagram 400 has the same operation as the apparatus shown inFIG. 2. Even the structural aspects of the apparatus shown in blockdiagram 400 are generally the same as those shown in FIG. 2, with theexception that (1) the pivot couple of FIG. 4 is different from thepivot couple (i.e., a joint 206) shown and described with reference toFIG. 2 and (2) FIG. 4 also includes a load plate 404 and a pressuresensor 406. The following description provides additional details aboutthe pivot couple of FIG. 4 as well as the load plate 404 and thepressure sensor 406.

The load plate 404 is coupled to the top surface of the heat sink base112. As shown in FIG. 4, the load plate 404 is affixed to a pressuresensor 406, which in turn is affixed to the top surface of the heat sinkbase 112. The pressure sensor 406 measures, and thus enables monitoringof, the force exerted by the load plate on the top surface of the heatsink base 112. In some implementations, the pressure sensor 406 may notbe used, in which case, the load plate 404 may be directly coupled tothe top surface of the heat sink base 112.

The pivot couple in FIG. 4 comprises a rod 402 and joint 408. The rod402 is coupled to the load plate 404, e.g., by screwing the rod 402 intothe load plate 404. The rod 402 includes an opening that receives thejoint 408. The support 110 is inserted into the joint 408 and isconfigured to pivot along an axis that is perpendicular to the rod 402and that is parallel to the mounting surface 214. In implementationswhere a load plate 404 is not used, the rod 402 can be directly coupledto the top surface of the heat sink base 112, e.g., by screwing the rod402 into the top surface of the heat sink base 112.

FIG. 5 is a block diagram 500 of a fourth implementation of the pivotcouple and support that are utilized in mounting the heat sink base ontoa heat load as shown in FIG. 1.

The block diagram 500 has the same operation as the apparatus shown inFIG. 4. Even the structural aspects of the apparatus shown in FIG. 5 arethe same as those shown in FIG. 4, with one exception. Unlike FIG. 4 inwhich the springs 206-A and 206-B, and the support 110 are discrete (andseparate) components, these pieces are integrated into one component inFIG. 5, as a support with integrated springs 502.

FIG. 6 is a block diagram 600 of a fifth implementation of the pivotcouple and support that are utilized in mounting the heat sink base ontoa heat load as shown in FIG. 1.

The block diagram 600 has the same operation as the apparatus shown inFIG. 4. Even the structural aspects of the apparatus shown in blockdiagram 600 are the same as those shown in FIG. 4, with one exception.The block diagram 600 includes a swivel 602 that is coupled (e.g.,affixed) to the load plate 404 and then the rod 402 is coupled to (e.g.,screwed onto) the swivel 602. The swivel 602 enables the rod 402 torotate about the swivel, independently of the load plate 404.

As noted with reference to FIG. 5, some implementations may not utilizea load plate 404. In such implementations, the swivel 602 is coupled tothe top surface of the heat sink base 112, and the rod 402 is thencoupled to the swivel 602 such that the rod 402 can rotate about theswivel, independently of the heat sink base 112.

In some implementations, the anchor-spring mounting approach describedwith reference to FIGS. 2-6 can be implemented using a base other than aheat sink base. In such implementations, the heat dissipating apparatusneed not be a heat sink.

While this specification contains many specific implementation details,these should not be construed as limitations on the scope of anyfeatures or of what may be claimed, but rather as descriptions offeatures specific to particular embodiments. Certain features that aredescribed in this specification in the context of separate embodimentscan also be implemented in combination in a single embodiment.Conversely, various features that are described in the context of asingle embodiment can also be implemented in multiple embodimentsseparately or in any suitable subcombination. Moreover, althoughfeatures may be described above as acting in certain combinations andeven initially claimed as such, one or more features from a claimedcombination can in some cases be excised from the combination, and theclaimed combination may be directed to a subcombination or variation ofa subcombination.

Thus, particular embodiments of the subject matter have been described.Other embodiments are within the scope of the following claims. In somecases, the actions recited in the claims can be performed in a differentorder and still achieve desirable results. In addition, the processesdepicted in the accompanying figures do not necessarily require theparticular order shown, or sequential order, to achieve desirableresults. In certain implementations, multitasking and parallelprocessing may be advantageous.

What is claimed is:
 1. A system comprising: a heat sink base that can bethermally coupled to a heat load, the heat sink base defining a top sideand a bottom side, wherein the bottom side defines a mounting surfacethat can be physically coupled to the heat load; a support that ispivotally coupled by a pivot couple to the top side of the heat sinkbase; at least a first anchor and second anchor, wherein: the firstanchor has a first end and a second end, wherein the first end connectsto a first anchor point, and the second end is coupled to a first loadsurface of the support by a first spring; the second anchor has a firstend and a second end, wherein the first end connects to a second anchorpoint, and the second end is coupled to a second load surface of thesupport by a second spring; and the first load surface and the secondload surface are symmetrically disposed on opposite sides of the pivotcouple; wherein the pivot couple is centrally located between the firstanchor and the second anchor so that a force imparted by spring loads ofthe first and second springs is normally transferred to the mountingsurface for even distribution over the mounting surface.
 2. The systemof claim 1, wherein: the pivot couple comprises a joint coupled to thetop side of the heat sink base, wherein the joint is centrally locatedbetween the first anchor and the second anchor; and the support iscoupled to the joint, wherein the support is configured to pivot aboutthe joint.
 3. The system of claim 2, wherein the support is integratedwith the joint, the first spring, and the second spring.
 4. The systemof claim 1, further comprising: a load plate coupled to the top side ofthe heat sink base; wherein the pivot couple is a rod that is coupled tothe load plate at a position that is centrally located between the firstanchor and the second anchor, wherein: the rod is perpendicular to theload plate; the rod includes an opening that receives a joint into whichthe support is inserted, wherein the support is configured to pivotalong an axis that is perpendicular to the rod and that is parallel tothe mounting surface.
 5. The system of claim 4, wherein a load platecoupled to the top side of the heat sink base comprises: a pressuresensor coupled to the top side of the heat sink base; the load platecoupled to the pressure sensor, wherein the pressure sensor measuresforce exerted by the load plate on the top surface of the heat sinkbase.
 6. The system of claim 5, wherein the support is integrated withthe first spring and the second spring.
 7. The system of claim 5,further comprising a swivel coupled to the load plate at a position thatis centrally located between the first anchor and the second anchor; andthe rod coupled to the swivel, wherein the rod can rotate independentlyof the load plate about the swivel.
 8. The system of claim 1, whereineach of the first anchor and the second anchor passes through arespective opening in the support and the heat sink base.
 9. The systemof claim 1, wherein each of the first anchor and the second anchorpasses through a respective opening in the support.
 10. The system ofclaim 2, wherein the support is integrated with the first spring and thesecond spring.
 11. A system comprising: a base that can be thermallycoupled to a heat load, the base defining a top side and a bottom side,wherein the bottom side defines a mounting surface that can bephysically coupled to the heat load; a support that is pivotally coupledby a pivot coupled to the top side of the base; at least a first anchorand a second anchor wherein: at least a first anchor has a first end anda second end, wherein the first end connects to a first anchor point,and the second end is coupled to a first load surface of the support bya first spring; the second anchor has a first end and a second end,wherein the first end connects to a second anchor point, and the secondend is coupled to a second load surface of the support by a secondspring; and the first load surface and the second load surface aresymmetrically disposed on opposite sides of the pivot couple; whereinthe pivot couple is centrally located between the first anchor and thesecond anchor so that a force imparted by spring loads of the first andsecond springs is normally transferred to the mounting surface for evendistribution over the mounting surface.
 12. The system of claim 11,wherein: the pivot couple comprises a joint coupled to the top side ofthe base, wherein the joint is centrally located between the firstanchor and the second anchor; and the support is coupled to the joint,wherein the support is configured to pivot about the joint.
 13. Thesystem of claim 12, wherein the support is integrated with the joint,the first spring, and the second spring.
 14. The system of claim 11,further comprising: a load plate coupled to the top side of the base;wherein the pivot couple is a rod that is coupled to the load plate at aposition that is centrally located between the first anchor and thesecond anchor, wherein: the rod is perpendicular to the load plate; therod includes an opening that receives a joint into which the support isinserted, wherein the support is configured to pivot along an axis thatis perpendicular to the rod and that is parallel to the mountingsurface.
 15. The system of claim 14, wherein a load plate coupled to thetop side of the base comprises: a pressure sensor coupled to the topside of the base; the load plate coupled to the pressure sensor, whereinthe pressure sensor measures force exerted by the load plate on the topside of the base.
 16. The system of claim 15, wherein the support isintegrated with the first spring and the second spring.
 17. The systemof claim 15, further comprising a swivel coupled to the load plate at aposition that is centrally located between the first anchor and thesecond anchor; and the rod coupled to the swivel, wherein the rod canrotate independently of the load plate about the swivel.
 18. The systemof the claim 11, wherein each of the first anchor and the second anchorpasses through a respective opening in the support and the base.
 19. Thesystem of claim 11, wherein each of the first anchor and the secondanchor passes through a respective opening in the support.